Laser processing device and laser processing method

Abstract

A laser processing device for forming an opening in an insulating layer of a wiring substrate includes a light source that emits a laser beam, an objective lens that focuses the laser beam onto a surface of a wiring substrate, a control device including circuitry that controls an irradiation condition of the laser beam, and a sensor that outputs to the control device a sensor output based on plasma light emitted from the wiring substrate due to irradiation of the laser beam. The circuitry of the control device recognizes a change in an irradiation site of the laser beam based on the sensor output, reduces processing capability of the laser beam and continues the irradiation upon.

Dependencies are inferred from the claim text.