Workpiece handling apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Ching Lo, Ching-Pin Yuan, Wei-Jie Huang, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Ching Lo, Ching-Pin Yuan, Wei-Jie Huang, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
Estimating the term…
A workpiece handling apparatus includes a workpiece chuck, and a robotic device. The workpiece chuck is for holding a workpiece thereon, wherein the workpiece chuck includes a porous supporting platform, a gas permeable buffer layer covering a supporting surface of the porous supporting platform, and a vacuum system in gas communication with the porous supporting platform and the gas permeable buffer layer. The robotic device is movably disposed over the workpiece chuck for picking up the workpiece and placing the workpiece on the gas permeable buffer layer.
A workpiece handling apparatus, comprising:
A workpiece handling apparatus, comprising:
A workpiece handling apparatus, comprising:
Dependencies are inferred from the claim text.