Auto-calibration to a station of a process module that spins a wafer

A method, comprising:

• delivering the calibration wafer to a process module via a gate valve, wherein the calibration wafer includes a notch when the process module is under the condition;
• determining a first orientation of the calibration wafer as the notch passes through a plurality of active wafer centering (AWC) sensors corresponding with the gate valve;
• placing the calibration wafer on a pedestal of the process module after the calibration wafer enters the process module;
• separating the calibration wafer from the pedestal;
• rotating the calibration wafer with respect to the pedestal;
• placing the calibration wafer on the pedestal after the calibration wafer has been rotated;
• exiting the calibration wafer from the process module via the gate valve;
• determining a second orientation of the calibration wafer as the notch passes through the plurality of AWC sensors;
• and
• determining a condition induced offset between the first orientation of the calibration wafer and the second orientation of the calibration wafer.