Semiconductor package and smiconductor package manufacturing method

A semiconductor package comprising:

• a carrier;
• an adhesive layer disposed on the carrier;
• and
• a plurality of dies disposed on the adhesive layer and bonded by the adhesive layer;
• and
• wherein the carrier includes a plurality of first regions in which the dies are disposed and a second region in which the dies are not disposed, and
• wherein a horizontal distance from a side of the carrier to the first region closest to the side is smaller than a horizontal distance from two first regions closest to each other among the plurality of first regions.

A semiconductor package manufacturing method comprising:

• a step of disposing a plurality of dies and dummy dies on a carrier while being spaced apart from each other;
• a first sawing step of sawing the carrier to separate the carrier into sub-panels on which the plurality of dies and dummy dies are disposed;
• a step of testing the dies;
• and
• a second sawing step of sawing between each die of the sub-panels to separate the sub-panels into individual semiconductor packages;
• and,
• wherein the carrier includes a plurality of first regions in which the die is disposed and second regions in which the die is not disposed, and
• wherein the dummy dies are disposed adjacent to a side of the first region.

A semiconductor package comprising:

• a carrier;
• an adhesive layer disposed on the carrier;
• and
• a plurality of dies and dummy dies disposed on the adhesive layer and bonded by the adhesive layer;
• and
• wherein the carrier includes a plurality of first regions in which the dies and dummy dies are disposed and a second region in which the dies are not disposed, and
• wherein the dummy dies are disposed adjacent to at least one side of the first region.