Method of forming semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng
Life of this patent
Estimating the term…
Abstract
A method of forming a semiconductor device includes the following steps. A die and a first through via aside the die are formed. An encapsulant is formed to encapsulate the die and the first through via, wherein the encapsulant is physically connected to a sidewall of the first through via and a sidewall of the die. A warpage controlling layer is formed over the encapsulant and the die. A first conductive connector is formed on the first through via to electrically connect to the first through via.
Claims20
A method of forming a semiconductor device, comprising:
- forming a die and a first through via aside the die;
- forming an encapsulant to encapsulate the die and the first through via, wherein the encapsulant is physically connected to a sidewall of the first through via and a sidewall of the die;
- forming a warpage controlling layer over the encapsulant and the die;
- and
- forming a first conductive connector on the first through via to electrically connect to the first through via.
A method of forming a semiconductor device, comprising:
- bonding a die to a circuit structure;
- forming an encapsulant over the circuit structure to encapsulate the die;
- forming a warpage controlling layer over the encapsulant to cover the die and the encapsulant;
- and
- removing a portion of the warpage controlling layer, to expose a portion of the encapsulant.
A method of forming a semiconductor device, comprising:
- forming a first through via laterally aside a die;
- forming an encapsulant to laterally encapsulate the first through via and the die;
- forming a warpage controlling layer to cover the encapsulant and the die;
- forming a first cap to cover the first through via, wherein the first cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the warpage controlling layer;
- and
- bonding a conductive terminal of a package to the first cap to form a first conductive connector between the first through via and the package.
Dependencies are inferred from the claim text.