Semiconductor device manufacturing method and semiconductor device manufacturing system

A semiconductor device manufacturing system comprising:

• a film forming apparatus configured to form an organic film composed of a polymer having a urea bond in a recess by supplying amine and isocyanate to a surface of a substrate having the recess;
• a processing apparatus configured to perform a predetermined process on the substrate on which the organic film is formed in the recess;
• and
• a heat treatment apparatus configured to remove the organic film in the recess by heating the substrate that has been subjected to the predetermined process to depolymerize the organic film,
• wherein the amine and the isocyanate have a terminal bifunctional linear chain structure having two functional groups at both ends of a linear chain, and
• wherein at least one of the amine or the isocyanate has side chains connected to the linear chain contained in the linear chain structure.