US 2026/0076032 A1 · OLED FRONT-PLANE MASK REDUCTION

Abstract

The present disclosure provides methods including disposing a plurality of metal layers over a substrate. The plurality of metal layers include a plurality of first sub-layers, a plurality of second sub-layers, and a plurality of third sub-layers. The methods include disposing the plurality of first sub-layers over the substrate. The second plurality of sub-layers are disposed over the plurality of first sub-layers. The third plurality of sub-layers are disposed over the plurality of second sub-layers. The plurality of first sub-layers include a first thickness. The plurality of second sub-layers include a second thickness. The plurality of third sub-layers include a third thickness. A supplemental material is disposed over the plurality of third sub-layers. A first resist is disposed over the supplemental material. An opening of the supplemental material is formed to expose a surface of a third sub-layer of the plurality of third sub-layers. The supplemental material is annealed.

Claims20

Dependent claims

A method, the method comprising:

disposing a plurality of metal layers over a substrate, the plurality of metal layers comprising a plurality of first sub-layers, a plurality of second sub-layers, and a plurality of third sub-layers, wherein disposing the plurality of metal layers comprises:
disposing the plurality of first sub-layers over the substrate, the second plurality of sub-layers over the plurality of first sub-layers, and the plurality of third sub-layers over the plurality of second sub-layers, wherein the plurality of first sub-layers comprise a first thickness, the plurality of second sub-layers comprise a second thickness, and the plurality of third sub-layers comprise a third thickness;
disposing a supplemental material over the plurality of third sub-layers;
disposing a first resist over the supplemental material;
forming an opening of the supplemental material to expose a surface of a third sub-layer of the plurality of third sub-layers;
and
annealing the supplemental material, wherein annealing the supplemental material comprises adjusting the third thickness of the third sub-layer of the plurality of third sub-layers.

4 more elements

A method, the method comprising:

disposing a plurality of metal layers over a substrate, the plurality of metal layers comprising a plurality of first sub-layers, a plurality of second sub-layers, and a plurality of third sub-layers, wherein disposing the plurality of metal layers comprises:
disposing the plurality of first sub-layers over the substrate, the second plurality of sub-layers over the plurality of first sub-layers, and the third plurality of sub-layers over the plurality of second sub-layers, wherein the plurality of first sub-layers comprise a first thickness, the plurality of second sub-layers comprise a second thickness, and the plurality of third sub-layers comprise a third thickness;
disposing a first supplemental material over the plurality of third sub-layers;
disposing a first resist over the first supplemental material;
forming an opening of the first supplemental material to expose a surface of a third sub-layer of the plurality of third sub-layers;
and
annealing the first supplemental material, wherein annealing the first supplemental material comprises adjusting the third thickness of the third sub-layer of the plurality of third sub-layers;
disposing a second supplemental material over the plurality of third sub-layers;
disposing a second resist over the second supplemental material;
forming an opening of the second supplemental material to expose a surface of the third sub-layer of the plurality of third sub-layers;
and
annealing the second supplemental material, wherein annealing the second supplemental material comprises adjusting the third thickness of the third sub-layer of the plurality of third sub-layers.

9 more elements

A method, the method comprising:

disposing a plurality of metal layers over a substrate, the plurality of metal layers comprising a plurality of first sub-layers, a plurality of second sub-layers, and a plurality of third sub-layers, wherein disposing the plurality of metal layers comprises:
disposing the plurality of first sub-layers over the substrate, the second plurality of sub-layers over the plurality of first sub-layers, and the third plurality of sub-layers over the plurality of second sub-layers;
disposing a supplemental material over the plurality of third sub-layers, wherein the supplemental material comprises a first oxide layer and a second oxide layer;
disposing a first resist over the supplemental material;
forming an opening of the supplemental material to expose a surface of a third sub-layer of the plurality of third sub-layers;
and
annealing the second oxide layer of the supplemental material;
disposing a plurality of pixel defining layer (PDL) structures between the plurality of metal layers, wherein adjacent PDL structures define a sub-pixel of a plurality of sub-pixels;
disposing a lower portion layer and an upper portion layer over the plurality of sub-pixels;
disposing a second resist over the lower portion layer and the upper portion layer;
patterning the second resist to form a first opening in a first sub-pixel of the plurality of sub-pixels, the first opening defining a plurality of overhang structures;
disposing a first organic light-emitting device (OLED) material on a metal layer of the first opening and the plurality of overhang structures;
disposing a cathode layer on the first OLED material and the plurality of overhang structures;
disposing a first encapsulation layer over the cathode layer and the plurality of overhang structures;
forming a third resist over the first encapsulation layer and the plurality of overhang structures;
removing a portion of the third resist over the plurality of overhang structures;
and
etching the first encapsulation layer, the cathode layer, the first OLED material, and a residual portion of the third resist to expose the plurality of overhang structures.

15 more elements

Dependencies are inferred from the claim text.

Oled front-plane mask reduction

Life of this patent

Oled front-plane mask reduction

Life of this patent

Abstract

Claims20