Thin film led package without substrate carrier

A method of fabricating a light-emitting diode (LED) device, the method comprising:

• attaching at least one LED structure to a frame via a temporary adhesive layer, the LED structures containing a semiconductor stack on a growth substrate and under bump metallization (UBM) to provide electrical coupling to at least one semiconductor layer of the semiconductor stack;
• depositing Silicone Molding Compound (SMC) to at least provide the SMC as underfill between the semiconductor stack and the temporary adhesive layer;
• removing the growth substrate to retain the semiconductor stack, the UBM, and the underfill on the temporary adhesive layer;
• providing reflective material between the LED structures after removing the growth substrate;
• and
• removing the temporary adhesive layer and frame after providing the reflective material of the LED device.

A light-emitting diode (LED) die array comprising a plurality of LED dice, each LED die comprising:

• a semiconductor stack that includes an n-type semiconductor, a p-type semiconductor, and an active region sandwiched between the n-type semiconductor and the p-type semiconductor, the semiconductor stack lacking a growth substrate;
• under bump metallization (UBM) electrically coupled to the p-type semiconductor and the n-type semiconductor;
• and
• molding compound disposed under the semiconductor stack adjacent to the UBM to substantially completely fill a space between the UBM as underfill and provide mechanical support for the LED die.