Semiconductor device with air spacers and method for fabricating the same
AssigneeNanya Technology Corporation
InventorKUO-HUI SU
Life of this patent
Estimating the term…
Loading patent…
AssigneeNanya Technology Corporation
InventorKUO-HUI SU
Estimating the term…
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a gate structure on the substrate; a plurality of inner spacer layers on sidewalls of the gate structure; a plurality of outer spacer layers on the plurality of inner spacer layers; a plurality of air gaps between the inner spacer layers and the outer spacer layers; a bottom dielectric layer on the substrate and laterally surrounding the outer spacer layers; a bottom capping layer on the bottom dielectric layer, the inner spacer layers, the air gaps, the outer spacer layers, and the gate structure; a conductive layer on the bottom capping layer and including a plurality of conductive wires; a top capping layer positioned on the conductive layer; and a plurality of air spacers positioned between the conductive wires.
A semiconductor device, comprising:
A method for fabricating a semiconductor device, comprising:
Dependencies are inferred from the claim text.