Semiconductor device and method for manufacturing the same
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsShota SUZUKI, Takeshi SHIBATA
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsShota SUZUKI, Takeshi SHIBATA
Estimating the term…
According to an embodiment, a semiconductor device includes a first electrode, and a gate electrode, first and second insulating portions, and a second electrode. The semiconductor portion has a trench that extends along a first direction. The semiconductor portion includes first to third semiconductor layers. The gate electrode is disposed in the trench so as to face the second semiconductor layer and the third semiconductor layer along a second direction orthogonal to the first direction. The gate electrode has a facing surface formed at a position facing the third semiconductor layer so as to be away from the third semiconductor layer as the facing surface extends upward. The first insulating portion is continuously provided on the semiconductor portion and inside the trench. The second insulating portion is provided on the gate electrode. A material of the second insulating portion is different from a material of the first insulating portion.
A semiconductor device comprising:
A method for manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.