Semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Zhen YU, Lin-Yu HUANG, Huan-Chieh SU, Lo-Heng CHANG, Meng-Huan JAO, Chih-Hao WANG
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Zhen YU, Lin-Yu HUANG, Huan-Chieh SU, Lo-Heng CHANG, Meng-Huan JAO, Chih-Hao WANG
Estimating the term…
A device includes a channel layer, a gate structure, a first source/drain epitaxial structure, a second source/drain epitaxial structure, a front-side interconnection structure, and a backside via. The gate structure is across the channel layer. The first source/drain epitaxial structure and the second source/drain epitaxial structure are on opposite sides of the gate structure and are connected to the channel layer. A height of the first source/drain epitaxial structure and a width of the first source/drain epitaxial structure are different. The front-side interconnection structure is on a front-side of the first source/drain epitaxial structure. The backside via is connected to a backside of the first source/drain epitaxial structure. A backside surface of the first source/drain epitaxial structure is at a level between a level of a backside surface of the backside via and a level of a backside surface of the gate structure.
A device comprising:
A device comprising:
A device comprising:
Dependencies are inferred from the claim text.