Semiconductor device and manufacturing method thereof
AssigneeTohoku University
InventorsTakashi MATSUOKA, Tetsuya SUEMITSU
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AssigneeTohoku University
InventorsTakashi MATSUOKA, Tetsuya SUEMITSU
Estimating the term…
In a first step S101, a first region in which a polarity inversion layer is formed, and a second region in which the polarity inversion layer is not formed are provided on a substrate. Next, in a second step S102, a first nitride semiconductor is epitaxially grown on the substrate having the first region and the second region along the c-axis direction such that a first semiconductor layer is formed. Next, in a third step S103, a second nitride semiconductor is epitaxially grown on the first semiconductor layer along the c-axis direction such that a second semiconductor layer is formed on the first semiconductor layer. The second nitride semiconductor has different polarization, electron affinity, and band-gap energy from the first nitride semiconductor. The second semiconductor layer forms a heterojunction with the first semiconductor layer. The interface therebetween has a polarization charge, which is positive or negative depending on polarity.
A method for manufacturing a semiconductor device, comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.