Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsRyohei GEJO, Tatsunori SAKANO, Yusuke KOBAYASHI
Life of this patent
Estimating the term…
Loading patent…
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsRyohei GEJO, Tatsunori SAKANO, Yusuke KOBAYASHI
Estimating the term…
According to one embodiment, a semiconductor device includes first to fourth electrodes, first and second terminals, a semiconductor member, and a first insulating member. The semiconductor member includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a third semiconductor region of the first conductivity type, a fourth semiconductor region of the second conductivity type, and a fifth semiconductor region of the second conductivity type. The first insulating member includes a first insulating region and a second insulating region. The first insulating region is between the third electrode and the semiconductor member. The second insulating region is between the fourth electrode and the semiconductor member.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.