Semiconductor structure
AssigneeCXMT Corporation
InventorsSHIJIE BAI, Bohui SHENG, Depeng RAO
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AssigneeCXMT Corporation
InventorsSHIJIE BAI, Bohui SHENG, Depeng RAO
Estimating the term…
Embodiments of the present disclosure provide a semiconductor structure, including multiple rows of first word lines and multiple first conductive lines. Each of the first conductive lines is provided in correspondence with and connected to each of the first word lines in odd-numbered rows or even-numbered rows; multiple first conductive contacts are each provided in correspondence with each of the first conductive lines, and multiple second conductive contacts are each provided in correspondence with and isolated from each of the first conductive contacts; and each of the second conductive contacts is connected to each of the first contact pads. The semiconductor structure in the embodiments of the present disclosure has a simpler interconnection manner, which simplifies a process flow while increasing signal density.
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.