Electronic device and method of cooling thereof

An electronic device for a high power, high voltage pulsed power supply for biasing a substrate in a plasma process, the electronic device comprising:

• a plurality of electrical components configured to generate heat when the device is in use;
• a container, wherein at least a part of the plurality of electrical components are placed in the container;
• an electrically insulating heat transfer liquid, filled within the container and having direct contact to the plurality of electrical components and configured to transport heat away from the plurality of electrical components;
• a liquid guiding equipment configured to guide the electrically insulating heat transfer liquid along at least a part of the plurality of electrical components such that the part of the plurality of electrical components are cooled with the same temperature,
• wherein the plurality of electrical components comprises semiconductor components including transistors and/or diodes connected in a series circuit, the series circuit configured to be connected to a high voltage greater than or equal to 1 kV when in operation, and
• wherein the semiconductor components in the series circuit are connected such that, in operation, the high voltage is divided between at least a part of the semiconductor components.