Cooling device
AssigneeJATCO Ltd
InventorsHisaya HAGIMORI, Yuuma MOCHIDUKI
Life of this patent
Estimating the term…
Abstract
A cooling device cools a power semiconductor device. The cooling device includes a tank that accommodates a power semiconductor device, insulating oil, and a refrigerant liquid having a boiling point temperature lower than a boiling point temperature of the insulating oil and a specific gravity larger than a specific gravity of the insulating oil. The insulating oil and the refrigerant liquid are stored in the tank in a mixed state to cool the power semiconductor device.
Claims7
1-6. (canceled)
A cooling device for cooling a power semiconductor device, the cooling device comprising:
- a tank configured to accommodate the power semiconductor device;
- insulating oil;
- and
- a refrigerant liquid having a boiling point temperature lower than a boiling point temperature of the insulating oil and a specific gravity larger than a specific gravity of the insulating oil, wherein
- the insulating oil and the refrigerant liquid are stored in the tank in a mixed state to cool the power semiconductor device, and
- in the cooling of the power semiconductor device, vaporization heat cooling is performed using the refrigerant liquid, wherein
- the refrigerant liquid is a fluorine-based refrigerant,
- the tank includes a first housing portion, a second housing portion, and a seal member that seals between the first housing portion and the second housing portion coupled to each other, and
- the seal member is provided within a range in a height direction in which the insulating oil is stored in accordance with the specific gravity.
A cooling device for cooling a power semiconductor device, the cooling device comprising:
- a tank configured to accommodate the power semiconductor device;
- insulating oil;
- and
- a refrigerant liquid having a boiling point temperature lower than a boiling point temperature of the insulating oil and a specific gravity larger than a specific gravity of the insulating oil, wherein
- the insulating oil and the refrigerant liquid are stored in the tank in a mixed state to cool the power semiconductor device, and
- in the cooling of the power semiconductor device, vaporization heat cooling is performed using the refrigerant liquid, wherein the cooling device further comprising:
- a sub-tank having an air chamber;
- a communication passage configured to allow the air chamber to communicate with an inside of the tank;
- and
- a shielding plate or a pipe member provided around an opening of a through hole of the communication passage that penetrates a side wall of the tank on an inner surface of the side wall and configured to prevent the refrigerant liquid from entering the sub-tank from the tank.
Dependencies are inferred from the claim text.