Semiconductor device

Abstract

A semiconductor device of an embodiment includes a circuit board, a base plate, a case, and a concave portion. The circuit board is equipped with semiconductor elements. The base plate supports the circuit board on a support surface. The case is adhered to the base plate at an adhesive region in a normal direction to the support surface. The case surrounds the circuit board. The base plate has a first inclined surface. The first inclined surface is inclined with respect to the support surface. The case has a second inclined surface. The second inclined surface is parallel to the first inclined surface and faces the first inclined surface in the normal direction. The adhesive region is provided on each of the first and second inclined surfaces. The concave portion opens to the outside between the base plate and the case. At least one of the first inclined surface and the second inclined surface is exposed in the concave portion.

Dependencies are inferred from the claim text.