Heat dissipation apparatus and in-vehicle module

An in-vehicle module comprising:

• a dissipation apparatus comprising:
• a heat sink housing,
• a primary printed circuit board,
• a sub printed circuit board, and
• a chip, wherein
• the sub printed circuit board and the chip are disposed in an inner part of the heat sink housing;
• the heat sink housing comprises an upper housing and a lower housing, the upper housing comprises a primary heat dissipation plate;
• the chip is fastened to the sub printed circuit board, the sub printed circuit board is connected to the primary heat dissipation plate by using an elastic support component, and the elastic support component is configured to press the sub printed circuit board to enable the chip to be pressed toward to the primary heat dissipation plate;
• and
• a thermally conductive layer is arranged between the chip and the primary heat dissipation plate, and the thermally conductive layer is configured to reduce contact thermal resistance between the chip and the primary heat dissipation plate.