Electronic assembly
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorJih Lung LIN
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AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorJih Lung LIN
Estimating the term…
An electronic assembly including a first circuit board assembly, a second circuit board assembly, a heat sink and a thermally conductive frame. The first circuit board assembly includes a first circuit board and a first heat source. The second circuit board assembly includes a second circuit board and a second heat source. The heat sink is located between the first circuit board and the second circuit board and includes a base and a plurality of heat dissipation fins. The plurality of heat dissipation fins protrude from a side of the base. The base is thermally coupled to the second heat source. The thermally conductive frame protrudes from the side of the base. Two opposite sides of the thermally conductive frame are thermally coupled to the base and the first heat source, respectively, and the thermally conductive frame forms at least one heat dissipation channel.
An electronic assembly, comprising:
Dependencies are inferred from the claim text.