Electronic assembly
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorJih Lung LIN
Life of this patent
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AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorJih Lung LIN
Estimating the term…
An electronic assembly including a first circuit board assembly, a second circuit board assembly and a heat sink. The first circuit board assembly includes a first circuit board and a first heat source. The second circuit board assembly includes a second circuit board and a second heat source. The heat sink includes a base part, a plurality of fin parts and a thermally conductive cover part. The base part has a hole. The plurality of fin parts and the thermally conductive cover part protrude from a side of the base part. The thermally conductive cover part covers the hole to form at least one heat dissipation channel in fluid communication with the hole. The base part is thermally coupled to the second heat source, and two opposite sides of the thermally conductive cover part are thermally coupled to the base part and the first heat source, respectively.
An electronic assembly, comprising:
Dependencies are inferred from the claim text.