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US 2026/0074701 A1Published application
Systems and methods for dynamic power and thermal management for programmable logic devices
AssigneeAltera Corporation
InventorsMahesh K. Kumashikar, Ankireddy Nalamalpu, Atul Maheshwari, Lai Guan Tang
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Abstract
Systems or methods of the present disclosure may provide a programmable logic device including one or more power monitors and one or more thermal sensors. The programmable logic device may include control circuitry that may receive power data and thermal data for multiple die of the programmable logic device, and may implement one or more response based on the thermal and power data.
Claims20
An electronic device package comprising:
- one or more voltage regulators;
- one or more thermal sensors to measure a thermal parameter;
- one or more compute die;
- and
- control circuitry to:
- determine a thermal level based on received thermal data;
- determine the thermal level exceeds one or more threshold values;
- and
- send instructions to one or more voltage regulators or one or more chiplets of the electronic device package to control thermal levels of the one or more compute die based on thermal data.
6 more elements
An electronic device package comprising:
- a plurality of compute die comprising a plurality of thermal sensors;
- and
- control circuitry to:
- receive thermal data from the plurality of thermal sensors located on the plurality of compute die;
- determine a hotspot in a first compute die using the thermal data;
- and
- cause programmable logic implemented in the hotspot to be implemented in a second compute die by reconfiguring one or more logic blocks from the first compute die to the second compute die.
4 more elements
A programmable fabric device package comprising:
- one or more voltage regulators;
- one or more thermal sensors to measure a thermal parameter;
- one or more interconnected fabric die;
- and
- control circuitry to:
- determine a thermal level based on received thermal data;
- determine the thermal level exceeds one or more threshold values;
- and
- send instructions to one or more voltage regulators or one or more chiplets of the programmable fabric device to control thermal levels of the one or more interconnected fabric die based on thermal data.
6 more elements
Dependencies are inferred from the claim text.