Wireless Circuitry with Integrated Multi-Band Front End
AssigneeApple Inc.
InventorsQishan Yu, Bradley D Scoles, Christopher J Huber
Life of this patent
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AssigneeApple Inc.
InventorsQishan Yu, Bradley D Scoles, Christopher J Huber
Estimating the term…
An electronic device may include a transceiver, first and second phased antenna arrays, and a radio-frequency front end (RFFE) module coupled between the transceiver and the arrays. The first array may convey first radio-frequency (RF) signals in a Frequency Range 3 (FR3) band. The second array may convey second RF signals in a Frequency Range 2 (FR2) band. The transceiver may include signal chains for the first and second arrays. The signal chains for the first array may transmit and/or receive the first RF signals in the FR3 band. The signal chains for the second array may convert baseband signals into intermediate frequency (IF) signals. An integrated circuit mounted to the RFFE module may convert the IF signals into the second RF signals and vice versa. The RFFE module may include FR2/FR3 selection switches that are shared by the first RF signals and the IF signals.
A radio-frequency front end (RFFE) module comprising:
A transceiver chip comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.