Defect detection using multiple algorithms
AssigneeApplied Materials Israel Ltd.
InventorsNir BARAM, Chen RAICH, Yoav ROSENBERG, Eli Alexander KAMINSKY, Aviad YAHALOM
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AssigneeApplied Materials Israel Ltd.
InventorsNir BARAM, Chen RAICH, Yoav ROSENBERG, Eli Alexander KAMINSKY, Aviad YAHALOM
Estimating the term…
There are provided systems and methods comprising obtaining a first set of candidate defects of a semiconductor specimen, acquired by an inspection tool associated with a first set of acquisition parameters, using one or more first algorithms to generate, based on the first set of candidate defects, a first reduced set of candidate defects, obtaining a second set of candidate defects of the specimen, acquired by the inspection tool associated with a second set of acquisition parameters, using the one or more first algorithms to generate, based on the second set of candidate defects, a second reduced set of candidate defects, comprising less candidate defects than the second set of candidate defects, and feeding the first reduced set of candidate defects and the second reduced set of candidate defects to a second algorithm, to generate a unified set of candidate defects.
A system comprising one or more processing circuitries configured to:
A system comprising one or more processing circuitries configured to:
A non-transitory computer readable medium comprising instructions that, when executed by one or more processing circuitries, cause the one or more processing circuitries to perform:
Dependencies are inferred from the claim text.