Microelectronic device cleaning composition
AssigneeEntegris, Inc.
InventorsAtanu K. Das, Daniela White, Michael L. White, Jun Liu, Aditya Dilip Verma
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Abstract
Provided are compositions and methods useful in the post-CMP cleaning of microelectronic devices, in particular, devices which contain one or more surfaces comprising hydrophobic carbon or SiC. In general, the compositions comprise a chelating agent; a water-miscible solvent; a reducing agent; and a pH adjustor, wherein the composition has a pH of about 2 to about 13.
Claims2
A method for removing residues from a microelectronic device substrate having said residues thereon, wherein the substrate possesses at least one surface comprising a substance chosen from copper, cobalt, tungsten, or a dielectric composition along with at least one surface comprising hydrophobic carbon or SiC,
- contacting the surface of a microelectronic device substrate with a composition comprising:
- a. a dispersant selected from the group consisting of monoethanolamine, triethanolamine, and tris(hydroxymethyl)aminomethane;
- b. a chelating agent selected from the group consisting of hydroxyethylidene diphosphonic acid;
- nitrilotris(methylene)phosphonic acid and citric acid;
- c. a water-miscible solvent selected from the group consisting of triethylene glycol monobutyl ether, dimethylsulfoxide, and diethylene glycol monobutyl ether;
- and
- d. a wetting agent selected from the group consisting of polyvinylpyrrolidone, hydroxyethylcellulose, ethoxylated C8-C18 alcohols, polystyrene sulfonic acid and salts thereof, poly(acrylic acid) and salts thereof, and poly(methacrylic acid), and salts thereof;
- and
- e. a pH adjustor selected from the group consisting of nitric acid, choline hydroxide, and KOH;
- and
- wherein the pH is about 2 to about 5;
- and at least partially removing said residues from said substrate.
Dependencies are inferred from the claim text.