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US 2026/0071106 A1Published application
Adhesive and reactive hot-melt adhesive
AssigneeMitsubishi Chemical Corporation
InventorsTakayuki NAKANE, Masato HIRONISHI
Life of this patent
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Abstract
The present disclosure relates to an adhesive containing a polyester (A) satisfying the following requirements (1) to (4): (1) the polyester (A) has a structural site derived from a polyvalent carboxylic acid (a1) and a structural site derived from a polyhydric alcohol (a2); (2) the polyester (A) has an ester bond concentration of 10.00 mmol/g or less; (3) the polyester (A) has a melting point of 30° C. or higher; and (4) the polyester (A) has a mass-average molecular weight of 25000 or more.
Claims18
A polyester (A) satisfying requirements (1) to (4) described below:
- (1) the polyester (A) has a structural site derived from a polyvalent carboxylic acid (a1) and a structural site derived from a polyhydric alcohol (a2);
- (2) the polyester (A) has an ester bond concentration of 10.00 mmol/g or less;
- (3) the polyester (A) has a melting point of 30° C. or higher;
- and
- (4) the polyester (A) has a mass-average molecular weight of 25000 or more.
2 more elements
Dependencies are inferred from the claim text.