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US 2026/0071099 A1Published application
Structural adhesives
AssigneeZephyros, Inc.
InventorMichael Czaplicki
Life of this patent
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Abstract
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.
Claims38
An adhesive formulation comprising:
- i) an adduct of an epoxy resin and an elastomer;
- ii) a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, wherein the adhesive formulation contains no more than 10% by weight of phenoxy resin;
- iii) a core/shell polymer;
- and
- iv) one or more additional epoxy resins.
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Dependencies are inferred from the claim text.