Release film and method for manufacturing multilayer electronic component using the same

Abstract

A release film includes a substrate layer, and a release layer disposed on one surface of the substrate layer, and including a cured product of a release composition, wherein, when a surface of the release layer is analyzed using X-ray photoelectron spectroscopy (XPS), a ratio (Si/C) of an amount (at %) of silicon to an amount (at %) of carbon is 0.15 to 0.20, and a surface hardness measured by a nanoindentation method is 200 MPa to 300 MPa, and the other surface of the substrate layer facing the one surface has a center line average roughness Ra of 15 nm or less.

Dependencies are inferred from the claim text.