Packaging structure and manufacturing method thereof

Abstract

A packaging structure and a manufacturing method thereof are provided. The packaging structure includes a substrate, a plurality of antenna module assembly, a first encapsulant layer, a superstrate, and a radome. The plurality of antenna module assembly is arranged in an array over the substrate. The first encapsulant layer is disposed on the array of antenna module assemblies and encapsulates each of the array of antenna module assemblies. The superstrate is disposed on the first encapsulant layer. An orthographic projection area of the superstrate on the substrate is larger than an orthographic projection area of each of plurality of antenna module assembly on the substrate. The radome is disposed on the superstrate.

Dependencies are inferred from the claim text.