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US 2026/0066248 A1Published application
Sputtering apparatus and sputtering method
AssigneeJapan Display Inc.
InventorArichika ISHIDA
Life of this patent
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Abstract
A sputtering apparatus includes: a substrate hold portion configured to hold a substrate; a first target facing the substrate hold portion; a second target facing the substrate hold portion and arranged side by side with the first target; and a partition wall between the first target and the second target, wherein each of a first normal line in an arbitrary position of the first target and a second normal line in an arbitrary position of the second target is connected to an arbitrary point on the substrate.
Claims17
A sputtering apparatus comprising:
- a substrate hold portion configured to hold a substrate;
- a first target facing the substrate hold portion;
- a second target facing the substrate hold portion and arranged side by side with the first target;
- and
- a partition wall between the first target and the second target,
- wherein each of a first normal line in an arbitrary position of the first target and a second normal line in an arbitrary position of the second target is connected to an arbitrary point on the substrate.
3 more elements
A sputtering apparatus comprising:
- a substrate hold portion configured to hold a substrate;
- a first target facing the substrate hold portion and attached with a first target member;
- and
- a second target facing the substrate hold portion, arranged side by side with the first target and attached with a second target member different from the first target member,
- wherein
- the first target member contains gallium.
3 more elements
A sputtering method comprising:
- holding a substrate to a substrate hold portion facing a first target and a second target;
- forming a stacked structure including a first material of the first target and a second material of the second target by:
- depositing the first material of the first target to the substrate by moving the first target and the substrate hold portion relatively while generating plasma for the first target in a first step;
- and
- depositing the second material of the second target to the substrate by moving the second target and the substrate hold portion relatively while generating plasma for the second target in a second step.
2 more elements
Dependencies are inferred from the claim text.