Electrostatic chucks with sensors to detect substrate deformation

A system, comprising:

• an electrostatic chuck comprising a clamping electrode configured to electrostatically secure a substrate to the electrostatic chuck responsive to being energized with a clamping voltage;
• a capacitive sensor disposed within the electrostatic chuck;
• and
• a processing device configured to:
• receive capacitance data, from the capacitive sensor, indicative of a change in capacitance measured by the capacitive sensor, wherein the change in capacitance is associated with substrate deformation of the substrate secured to the electrostatic chuck;
• determine, based on the capacitance data, substrate deformation of the substrate;
• and
• adjust the clamping voltage based on the substrate deformation.

A system, comprising:

• an electrostatic chuck configured to support a substrate, the electrostatic chuck comprising:
• a clamping electrode configured to electrostatically clamp the substrate to the electrostatic chuck responsive to being energized with a clamping voltage;
• and
• a distance sensor configured to sense a distance between the distance sensor and a bottom surface of the substrate supported on the electrostatic chuck;
• and
• a processing device communicatively coupled with the distance sensor, wherein the processing device is configured to:
• receive sensor data from the distance sensor;
• and
• adjust the clamping voltage based on the sensor data.