Memory packages with additional redundant storage

A memory package, comprising:

• a plurality of memory devices, each memory device in the plurality of memory devices comprising a memory array;
• and
• an additional die in communication with the plurality of memory devices, the additional die comprising:
• a redundancy check circuit configured to determine if a received address for the memory array on at least one memory device of the plurality of memory devices is a defective memory address;
• and
• redundant storage configured to store data associated with one or more defective addresses for the memory array.

A method, comprising:

• receiving, by an additional die and a memory device, an address for a memory array on the memory device;
• accessing redundant storage on the additional die based on the address being associated with one or more defective memory cells in the memory array;
• and
• accessing the memory array on the memory device based on the address not being associated with one or more defective memory cells in the memory array.