Memory packages with dynamically allocated error correction information

Abstract

A memory package may include multiple memory devices and a buffer die. In some examples, the buffer die and/or one or more of the memory devices may include an error correction code (ECC) circuit and/or a device health analysis circuit (DHAC). In some examples, memory devices may store ECC data for one or more other memory devices in the memory package. In some examples, memory arrays of the memory devices may be reorganized (reconfigured) to store more or less ECC data to dynamically allocate space to ECC data. In some examples, how much ECC data is stored for a memory device may be based, at least in part, on the error rate of the memory device.

Dependencies are inferred from the claim text.