Multiplexing for memory packages with buffer die and modules with same

Abstract

A memory package may include multiple memory die and a buffer die in some examples. The memory package may be included on a memory module. The memory module may include multiple memory packages. The buffer die may include components that reduce or eliminate a number of components on the memory module. In some embodiments, the buffer die may have components for performing error correction code operations, providing redundant memory portions, contention handling, multiplexing, interleaving, consolidating temperature and/or access information, self-testing, and/or self-training. In some examples, the memory package may include multilevel signaling, row buffers, memory built in self-testing, and/or modifications for processor-in-memory operations or accelerators therefor.

Dependencies are inferred from the claim text.