Contention measures for memory packages with buffer die
AssigneeMicron Technology, Inc.
InventorsMatthew A. Prather, Randall J. Rooney, Anthony D. Veches, Navid Lashkarian, Sujeet Ayyapureddi
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AssigneeMicron Technology, Inc.
InventorsMatthew A. Prather, Randall J. Rooney, Anthony D. Veches, Navid Lashkarian, Sujeet Ayyapureddi
Estimating the term…
A memory package may include multiple memory devices and a buffer die in some examples. The buffer die may include a contention circuit that detects conflicts/contentions between commands from a controller and housekeeping operations of the memory. In some examples, the contention circuit may request the controller resend the command in the event of a contention. In some examples, the buffer die may further include a queue to store commands and/or data. The queue may store the commands/data and/or responses from the memory devices for a set period of time and/or until the contention circuit determines the contention no longer exists.
An apparatus comprising:
A method comprising:
Dependencies are inferred from the claim text.