Active cooling of data processing systm using embedded controller in an advanced reduced instruction set computer machines (arm) architecture

A non-transitory machine-readable medium having instructions stored therein, which when executed by a processor, cause the processor to perform operations for providing active cooling using a fan controlled by an embedded controller in a data processing system having a processor installed on a system on a chip (SoC) that is originally only capable of providing passive cooling to the data processing system through throttling of the processor, the operations comprising:

• obtaining, by a power management circuit of the SoC, system temperature of the data processing system, the power management circuit being incapable of communicating directly with the embedded controller;
• obtaining, by an application digital signal processor (ADSP) of the SoC, the system temperature from the power management circuit;
• providing, by the ADSP, the system temperature to the embedded controller via an inter-integrated circuit (I2C)/improved inter-integrated circuit (I3C) interface;
• and
• providing, by the embedded controller, active cooling for the data processing system by controlling the fan based on the system temperature, the embedded controller being incapable of obtaining the system temperature without aid from the ADSP.

A data processing system comprising:

• a system on a chip (SoC) comprising a processor and memory, wherein the SoC is, without an embedded controller, only capable of providing passive cooling to the data processing system through throttling of the processor;
• a fan;
• and
• the embedded controller connected to the fan,
• wherein the memory stores instructions that, when executed by the data processing system, causes the data processing system to perform operations for providing the active cooling using the fan and the embedded controller, the operations comprising:
• obtaining, by a power management circuit of the SoC, system temperature of the data processing system, the power management circuit being incapable of communicating directly with the embedded controller;
• obtaining, by an application digital signal processor (ADSP) of the SoC, the system temperature from the power management circuit;
• providing, by the ADSP, the system temperature to the embedded controller via an inter-integrated circuit (I2C)/improved inter-integrated circuit (I3C) interface;
• and
• providing, by the embedded controller, active cooling for the data processing system by controlling the fan based on the system temperature, the embedded controller being incapable of obtaining the system temperature without aid from the ADSP.