Method for training opc modeling parameter
AssigneeShanghai Huali Integrated Circuit Corporation
InventorShunkui KE
Life of this patent
Estimating the term…
Loading patent…
AssigneeShanghai Huali Integrated Circuit Corporation
InventorShunkui KE
Estimating the term…
The present disclosure provides a method for training an OPC modeling parameter, including: step 1: designing a plurality of OPC patterns according to a design requirement for a lithography process layer layout; selecting at least one model parameter as a selected model parameter requiring training, and setting a plurality of different values for the selected model parameter; and collecting wafer pattern data formed by performing a lithography process on each OPC pattern; step 2: generating a sample unit and a sample set based on the collected data; step 3: inputting data of the sample set into a neural network for training; and step 4: performing OPC modeling using the trained neural network, where during the OPC modeling, an optimal value of the selected model parameter is obtained using the trained neural network, and the optimal value of the selected model parameter is used to perform the OPC modeling.
A method for training an OPC modeling parameter, comprising the following steps:
Dependencies are inferred from the claim text.