Semiconductor manufacturing apparatus and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu Kai Chen, Shang-Sheng Li, I-Chin Sung
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Abstract
A wafer processing apparatus according to the present disclosure includes an inner cup including a first cup wall and a first bottom surface, a middle cup enclosing the inner cup, the middle cup including a second cup wall and a second bottom surface between the first cup wall and the second cup wall, an outer cup enclosing the middle cup, the outer cup including a third cup wall and a third bottom surface between the second cup wall and the third cup wall, and a divider configured to move between a first position where a top surface of the divider is coplanar with the second bottom surface and a second position where the top surface of the divider rises above the second bottom surface.
Claims20
An apparatus, comprising:
- an inner cup comprising a first cup wall and a first bottom surface;
- a middle cup enclosing the inner cup, the middle cup comprising a second cup wall and a second bottom surface between the first cup wall and the second cup wall;
- an outer cup enclosing the middle cup, the outer cup comprising a third cup wall and a third bottom surface between the second cup wall and the third cup wall;
- and
- a divider configured to move between a first position where a top surface of the divider is coplanar with the second bottom surface and a second position where the top surface of the divider rises above the second bottom surface.
An apparatus, comprising:
- an inner cup comprising a first cup wall and a first bottom surface;
- a middle cup enclosing the inner cup, the middle cup comprising a second cup wall and a second bottom surface between the first cup wall and the second cup wall;
- an outer cup enclosing the middle cup, the outer cup comprising a third cup wall and a third bottom surface between the second cup wall and the third cup wall;
- a divider configured to move between a first position where a top surface of the divider is coplanar with the second bottom surface and a second position where the top surface of the divider rises above the second bottom surface, when the divider is in the second position, the second bottom surface is divided by the divider into an inner bottom surface adjacent the first cup wall and an outer bottom surface away from the first cup wall;
- a first drain hole in the inner bottom surface;
- a second drain hole in the outer bottom surface;
- and
- a third drain hole in the third bottom surface.
A method, comprising:
- placing a first wafer on a wafer holder mechanically secured on a rotatable shaft surrounded by an inner cup that is surrounded by a middle cup that is surrounded by an outer cup;
- moving the first wafer to a first position higher than a first cup wall of the inner cup but lower than a second cup wall of the middle cup;
- dispensing a first developer over the first wafer;
- rotating the first wafer while collecting excess first developer in a first channel between the first cup wall and the second cup wall;
- removing the first wafer;
- placing a second wafer on the wafer holder;
- moving the second wafer to a second position higher than the second cup wall of the middle cup but lower than a third cup wall of the outer cup;
- causing a divider wall to raise in the first channel to divide the first channel into an inner channel closer to the first cup wall and an outer channel closer to the second cup wall;
- dispensing a second developer over the second wafer;
- rotating the second wafer while collecting excess second developer in a second channel between the second cup wall and the third cup wall and the inner channel;
- and
- removing the second wafer.
Dependencies are inferred from the claim text.