Electro-optic modulator including optical and electrical signal paths via glass core substrate

Abstract

Various thin film modulator based hybrid-integrated electro-optic (EO) components compatible with 2.5D, 3D, and integrated laser 3D co-packaged optics integration technique. The hybrid-integrated electro-optic (EO) components use a glass core substrate to route optical signals and electrical signals between devices mounted directly or indirectly to the glass core substrate. The optical signal routing path within the glass core substrate may include one or more optical via holes, one or more mirror or reflectors, one or more lenses, high index waveguide, mode spot or field converters, and optical couplers including inverse tapered and tapered high index waveguides. The electrical signal routing paths within the glass core substrate may include a set of metal layers and a set of metallized via holes.

Dependencies are inferred from the claim text.