US 2026/0063853 A1 · CO-OPTICAL PACKAGE AND MANUFACTURING METHOD THEREOF

Abstract

A co-optical package and a manufacturing method thereof are provided. An electronic module includes a circuit structure, an electronic element and a photonic element. The circuit structure has a first side and a second side opposite to the first side. The electronic element is embedded in the circuit structure or disposed on the first side of the circuit structure. The photonic element having an optical active surface is embedded in the circuit structure and electrically connected to the electronic element. A portion of the circuit structure is removed from the first side to form an opening to expose the optical active surface of the photonic element. An optical element is disposed at the opening of the circuit structure and combined with the optical active surface of the photonic element. An encapsulation layer is formed on the first side of the circuit structure and covers the optical element.

Claims20

Dependent claims

A co-optical package, comprising:

a circuit structure having a first side, a second side opposite to the first side, and an opening, wherein the opening is formed on the first side of the circuit structure;
at least one electronic element embedded in the circuit structure or disposed on the first side of the circuit structure;
a photonic element embedded in the circuit structure and electrically connected to the at least one electronic element, wherein the photonic element has an optical active surface exposed from the opening of the circuit structure;
an optical element disposed at the opening of the circuit structure, wherein the optical element is combined with or corresponds to the optical active surface of the photonic element;
and
an encapsulation layer formed on the first side of the circuit structure and the optical element and covering the optical element.

3 more elements

A method of manufacturing a co-optical package, the method comprising:

providing an electronic module including a circuit structure, at least one electronic element and a photonic element, wherein the circuit structure has a first side and a second side opposite to the first side, and the at least one electronic element is embedded in the circuit structure or disposed on the first side of the circuit structure, wherein the photonic element has an optical active surface, is embedded in the circuit structure and is electrically connected to the at least one electronic element;
removing a portion of the circuit structure from the first side of the circuit structure to form an opening of the circuit structure to expose the optical active surface of the photonic element;
disposing an optical element at the opening of the circuit structure to be combined with or corresponding to the optical active surface of the photonic element;
and
forming an encapsulation layer on the first side of the circuit structure and the optical element to cover the optical element.

2 more elements

Dependencies are inferred from the claim text.

Co-optical package and manufacturing method thereof

Life of this patent

Co-optical package and manufacturing method thereof

Life of this patent

Abstract

Claims20