Bypass wavguide configured to facilitate inter-level optical coupling in optical module
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChan-Hong Chern
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChan-Hong Chern
Estimating the term…
Various embodiments of the present disclosure are directed towards a semiconductor device including a first optical interconnect extending in a first direction. The first optical interconnect includes a first body segment, a first tip segment, and a first tapered segment between the first body segment and the first tip segment. A dielectric layer overlies the first optical interconnect. A second optical interconnect overlies the dielectric layer and extends in the first direction. The second optical interconnect includes a second body segment, a second tip segment, and a second tapered segment between the second body segment and the second tip segment. The second tip segment overlies at least one of the first tip segment and the first tapered segment.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.