Probe unit, probe head, probe card, probe system, method of performing a test on an electronic device under test, and tested electronic device

A probe unit for contacting a plurality of conductive contacts of an electronic device under test integrated in a semiconductor wafer;

• the probe unit comprising:
• a plurality of probes each having a same length and each including a probe tail and a probe tip respectively located at two ends thereof, and a probe body between the probe tail and the probe tip;
• wherein the plurality of probes comprises;
• a first probe, the probe body of which comprises at least one slot extending along a longitudinal direction thereof and penetrating through the probe body of the first probe along a first transverse axis, such that the probe body of the first probe is hollow and defined by the at least one slot with at least two slats separated from each other along a second transverse axis and elastically bendable under an applied load;
• and
• a second probe, the probe body of which is solid and elastically bendable under an applied load;
• wherein the probe tail and the probe tip of each of the probes, each of the slats of the first probe, and the probe body of the second probe respectively define a cross-sectional area on an imaginary plane parallel to the first transverse axis and the second transverse axis;
• a sum of the cross-sectional areas of the at least two slats of the first probe is defined as a total cross-sectional area;
• the total cross-sectional area of the slats of the first probe is greater than the cross-sectional area of the probe body of the second probe;
• the cross-sectional area of the probe body of the second probe is smaller than the cross-sectional area of the probe tail of the second probe and smaller than the cross-sectional area of the probe tip of the second probe;
• and shapes of the slats of the first probe are configured such that a contact force of the first probe is greater than a contact force of the second probe.