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US 2026/0063570 A1Published application
Wafer inspection method and method of manufacturing semiconductor device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyunsoo Kwak, Sungyoon Ryu, Hyeungcheol Mun, Kwangseok Kim, Minjin Kim, Younghoon Sohn
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Abstract
Provided is a wafer inspection method including obtaining spectrum data for a wafer, sampling the spectrum data to obtain a first measurement position on the wafer, measuring a characteristic value of the wafer at the first measurement position, and generating a prediction model, using the spectrum data and the characteristic value at the first measurement position.
Claims20
A wafer inspection method comprising:
- obtaining spectrum data for a wafer;
- obtaining a first measurement position on the wafer by sampling the spectrum data;
- measuring a characteristic value of the wafer at the first measurement position;
- and
- generating a prediction model, using the spectrum data and the characteristic value at the first measurement position.
2 more elements
A wafer inspection method comprising:
- obtaining spectrum data for a wafer;
- classifying the spectrum data into k groups (k is a natural number greater than or equal to 2);
- selecting a total of n (n is a natural number greater than or equal to k) spectrum data from the k groups;
- measuring characteristic values of the wafer at first measurement positions corresponding to the n spectrum data, respectively;
- generating a prediction model using the n spectrum data and the characteristic values;
- and
- outputting a predicted characteristic value of the wafer by inputting spectrum data for the wafer into the prediction model.
4 more elements
A method of manufacturing a semiconductor device, the method comprising:
- performing a semiconductor process on a wafer;
- obtaining spectrum data for all chips included in the wafer;
- selecting sample spectrum data by sampling the spectrum data, based on a k-means clustering algorithm;
- measuring characteristic values of the wafer at first measurement positions on the wafer corresponding to the sample spectrum data;
- generating a prediction model for performing regression analysis, based on the sample spectrum data and the characteristic values;
- and
- outputting a predicted characteristic value of the wafer by inputting spectrum data for the wafer into the prediction model.
4 more elements
Dependencies are inferred from the claim text.