A semiconductor micro bump height measurement method, comprising the following steps of:
- placing a reference object and an target object on a work platform, wherein both the reference object and the target object are of a spherical shape, the height of the reference object is Hs, the height of the target object is H, both the reference object and the target object are semiconductor micro bumps;
- a light of a first light source and a light of a second light source being simultaneously reflected by the top of the reference object, a first image capture unit capturing an image of the top of the reference object through the reflected light of the first light source, and a second image capture unit capturing an image of the top of the reference object through the reflected light of the second light source;
- a first angle being formed between the light of the first light source and a horizontal plane passing through the top of the reference object, a second angle being formed between the reflected light of the first light source and the horizontal planes passing through the top of the reference object, and the first angle being equal to the second angle;
- moving the work platform or moving the first light source, the second light source, the first image capture unit, and the second image capture unit;
- the light of the first light source being reflected by the top of the target object, the first image capture unit capturing an image of the top of the target object by the reflected light of the first light source, and a sensing unit sensing a first movement distance of the work platform or a first movement distance of the first light source and the first image capture unit, and defining the first movement distance as d;
- the light of the second light source being reflected by the top of the target object, the second image capture unit capturing an image of the top of the target object by the reflected light of the second light source, and a sensing unit sensing a second movement distance of the work platform or a second movement distance of the second light source and the second image capture unit, and defining the second movement distance as D;
- and
- when the first movement distance being equal to the second movement distance, a processing unit determining that a height of the target object being equal to the height of the reference object and the target object as non-defective;
- when the first movement distance being greater than the second movement distance, the processing unit determining that the height of the target object being greater than the height of the reference object and determining the target object as defective, and calculating the height of the target object as:
- ΔH=(d−D)×tan(θ), H=Hs+ΔH, where θ equal to the first angle;
- when the first movement distance being smaller than the second movement distance, the processing unit determining that the height of the target object being less than the height of the reference object and determining the target object as defective, and calculating the height of the target object as:
- ΔH=(D−d)×tan(θ), H=H_s−ΔH, where θ is equal to the first angle.