US 2026/0062772 A1 · PHASE CHANGE METAL ALLOYS AND THERMAL INTERFACE MATERIAL ASSEMBLY COMBINING A PATTERNED METAL FOIL WITH A PHASE CHANGE METAL ALLOY

Abstract

Phase change metal alloys and their uses as thermal interface materials in electronic assemblies are described. In one implementation, a phase change metal alloy includes: 50 wt % to 70 wt % In; at least one of: 20 wt % to 40 wt % Bi and 10 wt % to 50 wt % Sn; and greater than 0 wt % to 5.0 wt % Zn. The phase change metal alloy can also include one or more of: greater than 0 wt % to 5.0 wt % Ga; greater than 0 wt % to 1.0 wt % Ag; greater than 0 wt % to 1.0 wt % Cu; greater than 0 wt % to 1.0 wt % Au; greater than 0 wt % to 0.1 wt % Ni; and greater than 0 wt % to 0.1 wt % Ge.

Claims22

Dependent claims

A phase change metal alloy (PCMA), comprising:

50 wt % to 70 wt % In;
at least one of:
20 wt % to 40 wt % Bi, and
10 wt % to 50 wt % Sn;
and
greater than 0 wt % to 5.0 wt % Zn.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

19/309,291Filed 25 Aug 2025

Priority

29 Aug 2024

Published

5 Mar 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

C22C 28/00
Alloys based on a metal not provided for in groups c22c5/00 -
C09K 5/06
Materials undergoing a change of physical state when used: the change of state being from liquid to solid or vice versa
H10W 40/255
Characterised by their materials: having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
H10W 40/258
Characterised by their materials: metallic materials

Phase change metal alloys and thermal interface material assembly combining a patterned metal foil with a phase change metal alloy

Life of this patent

Phase change metal alloys and thermal interface material assembly combining a patterned metal foil with a phase change metal alloy

Life of this patent

Abstract

Claims22