Metal or alloy film release by low sublimation release layer for electrochemical device
AssigneeElevated Materials US LLC
InventorsKankona S Roy, Subramanya P. Herle, Gopi Chandran RAMACHANDRAN
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AssigneeElevated Materials US LLC
InventorsKankona S Roy, Subramanya P. Herle, Gopi Chandran RAMACHANDRAN
Estimating the term…
Embodiments of the present disclosure relate to methods and devices related to thin film alkali metal energy storage devices. The method for transferring an alkali metal layer includes disposing a release layer over a flexible substrate, the release layer including a low sublimation point, wherein the low sublimation point is less than 120° C., disposing the alkali metal layer onto the release layer, laminating the release layer and the alkali metal layer between the flexible substrate and a first flexible carrier, sublimating the release layer via a treatment source to transfer the alkali metal layer from the flexible substrate to the first flexible carrier, the treatment source operable to pattern the alkali metal layer, and peeling away the flexible substrate from the first flexible carrier.
A method for transferring an alkali metal layer comprising:
A method for transferring an alkali metal layer comprising:
A method for making an energy storage device, comprising:
An alkali metal-containing film stack for energy storage devices, comprising:
Dependencies are inferred from the claim text.