A method of teaching substrate handling in a semiconductor processing system, wherein the semiconductor processing system comprises:
- a jig including a disc body having a first surface opposite a second surface, and a thickness separating the first surface from the second surface, the disc body defining a fixation aperture extending through the thickness of the disc body and coupling the first surface to the second surface of the disc body, the disc body further defining a verification aperture extending through the thickness of the disc body radially outward of the verification aperture and coupling the first surface to the second surface of the disc body;
- a fixation pin;
- and
- a verification pin, the method comprising:
- teaching a front-end transfer robot-to-load lock transfer position to a front-end transfer robot in the semiconductor processing system by:
- (a) clamping the disc body within a clamp end effector of the front-end transfer robot in the semiconductor processing system;
- (b) registering the disc body to a chill plate located within the semiconductor processing system using the front-end transfer robot;
- (c) inserting the verification pin into the disc body and advancing the verification pin to a surface of the chill plate;
- (d) indicating misregistration between the disc body and the chill plate using the verification pin;
- (e) adjusting position of the disc body using the front-end transfer robot when misregistration between the disc body and the chill plate prevents insertion of the verification pin into a verification pin seat defined in the chill plate;
- and
- (f) writing position of the front-end transfer robot as the front-end transfer robot-to-load lock transfer position when registration of the disc body to the chill plate allows the verification pin to be advanced into the chill plate, wherein the writing comprises recording the position of the front-end transfer robot into memory associated with the semiconductor processing system;
- teaching a back-end transfer robot-to-load lock transfer position to a back-end transfer robot in the semiconductor processing system by:
- (g) fixing the disc body on a blade end effector of the back-end transfer robot in the semiconductor processing system using the fixation pin;
- (h) registering the disc body to the chill plate using the back-end transfer robot;
- (i) inserting the verification pin into the disc body and advancing the verification pin to the surface of the chill plate;
- (j) indicating misregistration between the disc body and the chill plate using the verification pin;
- (k) adjusting position of the disc body using the back-end transfer robot when misregistration between the disc body and the chill plate prevents insertion of the verification pin into the chill plate;
- and
- (l) writing position of the back-end transfer robot as the back-end transfer robot-to-load lock transfer position when registration of the disc body to the chill plate allows the verification pin to be advanced into the chill plate, wherein the writing comprises recording the position of the back-end transfer robot into the memory;
- and
- teaching a substrate centering position to a substrate centering sensor in the semiconductor processing system by:
- (m) transporting the disc body between a load lock and a process module of the semiconductor processing system while the disc body is fixed on the blade end effector;
- (n) acquiring centering of disc body on the blade end effector with the substrate centering sensor during transport between the load lock and the process module;
- (o) determining a substrate centering using the centering of the disc body acquired by the substrate centering sensor;
- and
- (p) writing the substrate centering as the substrate centering position, wherein the writing comprises recording the substrate centering position into the memory.