Silver-plated product and method for producing same

Abstract

There are provided a silver-plated product which is difficult to allow a silver-plating film to be peeled off from an underlying plating film to have an excellent adhesion in a high-temperature and high-humidity environment when the silver-plating film is formed on a base material via the underlying plating film, and a method for producing the same. After an underlying silver-plating film (preferably having a thickness of 0.06 to 15 μm) is formed on a base material (of preferably copper or a copper alloy) via an underlying plating film (of preferably copper, nickel or an alloy thereof), a surface layer of silver containing carbon and sulfur (a silver-plating film containing carbon and sulfur) (preferably having a thickness of 0.1 to 2.0 μm) is formed on the underlying silver-plating film by electroplating in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof.

Dependencies are inferred from the claim text.