Film frame carrier with whole wafer hybrid chuck
OwnerChow Tian Lim, Rajeev Patilinventors
Life of this patent
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Abstract
The system includes a chuck defining a planar surface and peripheral surface surrounding the planar surface, a plurality of lift pins disposed within a plurality of apertures defined in the planar surface of the chuck, and a plurality of frame handles connected to the peripheral surface of the chuck. The plurality of lift pins are configured to extend out of the plurality of apertures above the planar surface to support a whole wafer, and the plurality of frame handles are configured to support a frame of a film frame carrier. The plurality of lift pins are further configured to retract into the plurality of apertures beneath the planar surface, with the planar surface of the chuck being configured to support a wafer of the film frame carrier.
Claims20
A system comprising:
- a chuck defining a planar surface and peripheral surface surrounding the planar surface;
- a plurality of lift pins disposed within a plurality of apertures defined in the planar surface of the chuck, the plurality of lift pins being configured to extend out of the plurality of apertures above the planar surface to support a whole wafer;
- and
- a plurality of frame handles connected to the peripheral surface of the chuck, the plurality of frame handles being configured to support a frame of a film frame carrier;
- wherein the plurality of lift pins are further configured to retract into the plurality of apertures beneath the planar surface, with the planar surface of the chuck being configured to support a wafer of the film frame carrier.
A method comprising:
- providing a chuck defining a planar surface and peripheral surface surrounding the planar surface;
- controlling a plurality of lift pins disposed within a plurality of apertures defined in the planar surface of the chuck to extend out of the plurality of apertures above the planar surface of the chuck;
- disposing a whole wafer on the plurality of lift pins extended out of the plurality of apertures above the planar surface of the chuck;
- removing the whole wafer from the plurality of lift pins;
- controlling the plurality of lift pins to retract into the plurality of apertures beneath the planar surface of the chuck;
- disposing a frame of a film frame carrier onto a plurality of frame handles connected to the peripheral surface of the chuck, with a wafer of the film frame carrier being supported by the planar surface of the chuck;
- and
- removing the frame of the film frame carrier from the plurality of frame handles.
Dependencies are inferred from the claim text.