Heat exchange module and substrate processing apparatus including the same
AssigneeWonik Ips Co., Ltd.
InventorsJeong Lim SON, Joo Suop KIM, Kee Jun KIM, Sang Cheol PARK, Jae Hwan LIM
Life of this patent
Estimating the term…
Loading patent…
AssigneeWonik Ips Co., Ltd.
InventorsJeong Lim SON, Joo Suop KIM, Kee Jun KIM, Sang Cheol PARK, Jae Hwan LIM
Estimating the term…
A heat exchange module installed to be in constant communication with a high-pressure vessel forming a heating space (S2) under high-temperature and high-pressure process conditions, comprises: a main body unit (500) forming a heat exchange space (S4) therein; a flow path forming unit (600) provided to form a flow path in which exhaust gas discharged from the high-pressure vessel flows within the heat exchange space (S4); and a heat medium piping unit (700), at least a portion of which is installed within the heat exchange space (S4), with a heat medium flowing therein for direct or indirect heat exchange with the exhaust gas.
A heat exchange module installed to be in constant communication with a high-pressure vessel forming a heating space (S2) under high-temperature and high-pressure process conditions, comprising:
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.