On tool metrology scheme for advanced packaging
AssigneeApplied Materials, Inc.
InventorUlrich MUELLER
Life of this patent
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Abstract
Systems and methods disclosed herein relate to a digital lithography system and method for alignment resolution with the digital lithography system. The digital lithography system includes a metrology system configured to improve overlay alignment for different layers of the lithography process. The metrology system allows for decreased size of alignment marks. Based on determining the positions of alignment marks with the metrology system, correction data is obtained to achieve accurate overlay of layers on subsequent patterning processes.
Claims20
A metrology system, comprising:
- a microscope body;
- a lens coupled to the microscope body;
- a focusing stage disposed between the microscope body and the lens, wherein the focusing stage is configured to move the lens to adjust a focus of the lens;
- a camera coupled to the microscope body;
- a first LED, a second LED, and a third LED coupled to the microscope body, wherein the LEDs deliver light to the microscope body;
- and
- an illuminator disposed below the lens.
A digital lithography system, comprising:
- a slab;
- a moveable stage disposable over the slab, the moveable stage configured to support a substrate;
- a support coupled to the slab having an opening to allow the moveable stage to pass thereunder;
- one or more image projection systems (IPSs) coupled to the support;
- and
- one or more metrology systems coupled to the support, wherein the one or more metrology systems each include:
- a microscope body;
- a lens coupled to the microscope body;
- a focusing stage disposed between the microscope body and the lens,
- wherein the focusing stage is configured to move the lens to adjust a focus of the lens;
- a camera coupled to the microscope body;
- a first LED, a second LED, and a third LED coupled to the microscope body, wherein the LEDs deliver light to the microscope body;
- and
- an illuminator disposed below the lens.
A method of mark measurements on a substrate;
- moving a lens vertically to adjust a focus of the lens on a substrate;
- providing illumination to the substrate via one or more LEDs and an illuminator;
- capturing images of alignment marks on the substrate or die marks on dies of the substrate positioned on a digital lithography system, wherein the images are captured at different focuses by moving the lens vertically, wherein the alignment marks and the die marks each have a width less than 50 um, wherein the images of the alignment marks or the die marks are captured with a microscope body coupled to the lens;
- determining a position of the alignment marks and the die marks;
- comparing the position of the alignment marks and the die marks with a design file to obtain correction data;
- and
- patterning subsequent layers onto the substrate with reference to the correction data, wherein the correction data improves overlay alignment accuracy of the subsequent layers and corrects die placement errors on the substrate.
Dependencies are inferred from the claim text.